| 摘要 |
PURPOSE:To form highly reliable conductor wirings on the upper part without formation of 'angled portion' at a pattern after the heat treatment by selectively developing photoresist and polyimide precursor film to peel the photoresist and placing a substrate in contact with a heat source to heat the polyimide precursor film up to the predetermined temperature or higher. CONSTITUTION:A substrate 1 is first coated with polyimide precursor vanish and it is prebaked to form a polyimide precursor film 2. This polyimide precursor film 2 is then coated with photoresist and is then prebaked. Next, the photoresist film is selectively exposed and developed to eliminate unexposed portion or exposed portion. In this case, the lower polyimide precursor film 2 is eliminated simultaneously or the lower polyimide precursor film 2 is eliminated using a pattern of the obtained photoresist used as a mask. Consequently, the photoresist is peeled. After the photoresist is peeled, the substrate 1 is placed in contact with the heat source to quickly heat the polyimide precursor film 2 up to 160 deg.C or higher. |
