| 摘要 |
PURPOSE:To prevent breaks of the joints between inner leads and gold wires and to improve heat dissipation property in a resin-sealed semiconductor device with a heat sink. CONSTITUTION:A glass 8 is used to insulate and adhere a heat sink 2 and an inner lead 5 in this device with the heat sink, thus preventing ultrasonic waves for jointing the inner lead 5 and the gold wire 6 from being absorbed achieving a high joint strength. Also, the glass 8 has better thermal conductivity than a current insulation resin and an adhesive, thus making the heat escape from the semiconductor element 1 to the heat sink 2 and from the heat sink 2 to the inner lead 5.
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