| 摘要 |
<p>A lead-free and bismuth-free solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition consists of, in weight percent, 90.3-99.2 % tin, 0.5-3.5 % silver, 0.1-2.8 % copper, and 0.2-2.0 % antimony. The alloy composition has a melting temperature of 210-216 °C with superior wetting and mechanical strength making the alloy composition well suited for electronic circuit board manufacture and replacement of conventional tin-lead solders.</p> |
