Semiconductor module and ic package used for the semiconductor module

摘要

A semiconductor module including a plurality of circuit boards, each circuit board having two opposed surfaces on which IC packages having leads extending outward through upper or lower portions of side surfaces are mounted. The circuit boards are superposed one on another and the IC packages are arranged to prevent contact between the leads of the IC packages disposed close to or in contact with each other in a back-to-back relationship between each adjacent pair of circuit boards. The IC packages mounted between each adjacent pair of circuit boards in a back-to-back relationship are upper lead type IC packages on one of the circuit boards and lower lead type IC packages on the other circuit board.