| 摘要 |
PURPOSE:To prevent generation of warpage by a method wherein a semiconductor device is formed in one-layer structure consisting of a resin package part only by electrically connecting a bump and the pad of a semiconductor element. CONSTITUTION:This semiconductor device is provided with a tape lead 31, a semiconductor element 32, a wire 33, a resin package part 34 and a bump 35. An electric connection means is composed of a tape lead 31 and a wire 33, and the device functions as a one layer structure. As a result, each part in the direction of thickness is thermally expanded even when the semiconductor device is heated up, namely, the part is thermally deformed while a flat state is being maintained, and a warp is not generated. As a result, the semiconductor device is mounted in such a manner that all bumps 35 are completely soldered to the pad 61 on a multilayer printed substrate 60. Also, unnecessary stress does not work on the semiconductor element 32, and the semiconductor element 32 is not subjected to the adverse effect by stress. The heat of the semiconductor element 32 is excellently discharged through the intermediary of a heat- dissipating pattern 63.
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