RESIN MOLDING MATERIAL FOR SEALING

摘要

PURPOSE:To obtain a resin molding material for sealing excellent in crack resistance after hygroscopic soldering treatment. CONSTITUTION:This resin molding material for sealing contains a vinyl ester resin and an organopolysiloxane. The vinyl ester resin is added in an amount of preferably 5-25wt.% based on the total amount. The whole organopolysiloxanes such as silicone oils and silicone rubbers can be used as the organopolysiloxane and the amount thereof added is preferably 1-5wt.% based on the total amount.