| 摘要 |
PURPOSE:To simply remove a protruded adhesive without reducing the positioning precision, adhesive strength, and durability by locally hardening an adhesive at the inside portion of an adhesive face, temporarily fixing both arrays, removing the unhardened adhesive protruded from the outer edge, then hardening the unhardened adhesive near the outer edge. CONSTITUTION:An adhesive is applied to the whole area of the adhesive face between a scintillator array 1 and a photo-diode array 2, and part of it is protruded from the outer edge (protruded adhesive 4). Both arrays 1, 2 are positioned by a positioning jig with high precision, both channels are accurately matched, ultraviolet rays are locally radiated via a mask to an inside portion 5 from the outer edge of the adhesive face on the array 1 side to harden the adhesive, and both arrays 1, 2 are temporarily fixed. Both arrays 1, 2 (detector block) are removed from the jig, the unhardened protruded adhesive 4 is removed, ultraviolet rays are radiated to the remaining portion of the adhesive face to harden the adhesive on the hole area of the adhesive face, and both arrays 1, 2 are permanently fixed.
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