| 摘要 |
PURPOSE: To expose gold contact vergin area for a lead frame and for wire bonding by providing a contact material disposed to cover a plurality of bases for the wire bonding and further providing a protective material disposed to cover the contact material and protect integration of the contact material during molding work thereafter. CONSTITUTION: A copper lead frame is used for a lead frame 18, and the entire of the copper lead frame is plated with a nickel layer 20 in a lead frame processing. The position 12 of the wire bonding base is further plated with a material 22 to be used for forming a bond pad for the wire bonding base. Gold is used for forming the plated layer 22. A protective layer 24 is formed to protect the layer 22. Then, a residue 26 is removed using an etchant (10% ammonium hydroxide and 10% HCl) for preferentially etching the protective layer 24 with respect to the remaining lead frame material. Hereby, a gold contact between the lead frame and the wire bonding base can be exposed. |
