PRODUCTION OF PRERREG FOR MULTILAYER PRINTED WIRING BOARD

摘要

PURPOSE:To provide the production process whereby a multilayer printed wiring board with a dent-free outer metallic foil, can be obtained. CONSTITUTION:The production process comprises drilling holes in a prepreg prepared by impregnating a base with a resin, drying the resin to a tack-free state, cutting the base to a specified size, and heating the surface and edge face of the prepreg and the wall of each hole to melt the resin of the prepreg.