Film for thermal stencil sheets having specific thermal stresses and shrinkage

摘要

A novel film material for thermal stencil sheets is disclosed. The film comprises a biaxially stretched polyester film which contains 0.1-5.0% of fine particles having an average diameter of 0.05-2.0 mu m and has a melting point of 170 DEG -230 DEG C. and a thickness of 0.5-2.5 mu m and the maximum value of an average longitudinal and transversal thermal construction stress of the film at a temperature of 100 DEG -160 DEG C. is 500-1500 g/mm2. The film for heat-sensitive mimeographic printing stencil sheets of the present invention is excellent in handling property sensitivity to thermal perforation, resolution in printing, tone property and curling resistance and thus the invention is industrially very significant.