发明名称 DIE BONDING METHOD AND DEVICE THEREOF
摘要 <p>PURPOSE:To make it possible to continue die bonding without halting the operation of a device by picking up the tip of a collet with an ITV and spraying a gaseous body to a foreign matter if detected and removing the foreign matter. CONSTITUTION:A collet 2 loads a die 4 on an island 6 on a lead frame 5 and then operates so as to pick up a succeeding die as shown in an arrow F and moves to a ring 3. During the movement of the collet, an ITV 7 picks up the tip of the collet 2 and feeds the image to an image processing device 9 and compares the image with a collet preliminarily memorized and determines the presence of a foreign matter and the type of the detected foreign matter. In case when the attracted foreign matter is a metal, such as solder, a heater 20 installed to the collet 2 is heated by the command from a die bonding control device 10 and the metal foreign matter is softened. After the foreign matter is softened, an air or an N2 gas is fed into a space 22 installed coaxially with a hollow hole 21, thereby blowing off the foreign matter. This construction makes it possible to continue the die bonding.</p>
申请公布号 JPH06302630(A) 申请公布日期 1994.10.28
申请号 JP19930089764 申请日期 1993.04.16
申请人 SUMITOMO ELECTRIC IND LTD 发明人 MORIYAMA YUTAKA
分类号 H01L21/52;H01L21/677;H01L21/68;H04N7/18;(IPC1-7):H01L21/52 主分类号 H01L21/52
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