发明名称 AIR-COOLED ELECTRONIC EQUIPMENT
摘要 <p>PURPOSE:To perform efficient cooling and further to make the temperature distribution of a chip uniform and to obtain a reliability improving method, a method for reducing fan power, reduction of the noise of the whole housing, and diverse development of design. CONSTITUTION:Flow passages of >=2 systems are formed in the housing of a high- performance arithmetic machine 1 to provide cooling fans 7 between heat generation bodies in the respective flow passages, provide a flow passage exit below, arrange the cooling fans 7 separately from each other, provide a cooling fan in a corner of a bent flow passage, arrange the cooling fans 7 separately in the horizontal direction, constitute the whole housing in double structure, form the CPU package of a core in a duct shape, or provide a resin molding at the center part of a front panel. Thus, >=2 flow passages are provided and the cooling fans 7 are provided between the heat generation bodies in the respective flow passages to actualize maintenance similar to conventional maintenance, and to make the temp. distribution of each package and each heat generation body uniform, cooling performance improvement, reliability improvement, reduction of fan power, and reduction of the noise of the whole housing are obtained, and inexpensive and diverse design development can be performed.</p>
申请公布号 JPH06301450(A) 申请公布日期 1994.10.28
申请号 JP19930089695 申请日期 1993.04.16
申请人 HITACHI LTD 发明人 KONDO YOSHIHIRO;HONMA TETSURO;IWAI SUSUMU;YAMADA HIROSHI;MORITA KAZUO;ITO HIROSHI;MATSUSHIMA HITOSHI;HATADA TOSHIO;IIDA AKIYOSHI;SHIMOIDE SHINICHI;KUMAGAI KENTA
分类号 G06F1/20;(IPC1-7):G06F1/20 主分类号 G06F1/20
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