发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To perform bonding to the operation part of a lead wire quickly and positively. CONSTITUTION:Containers 4 and 5 with a bonding surface 2 at the bottom of a recessed part are heated, machining is made to a shape where no recessed part upper surface 7 is in contact previously, a lead part 6 for connecting the bonding surface 2 at the bottom of the recessed part with the recessed part upper surface 7 is connected to the bonding surface 2, and then the lead part 6 is connected to the recessed part upper surface 7.
申请公布号 JPH06302654(A) 申请公布日期 1994.10.28
申请号 JP19930084447 申请日期 1993.04.12
申请人 JAPAN ENERGY CORP 发明人 TEZUKA TOSHIO;KATO SHINICHI
分类号 H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L21/60
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