| 摘要 |
<p>According to the invention, a method and structure for flip chip interconnection of an integrated circuit chip to a substrate is provided. In one embodiment of the invention, an integrated circuit includes a semiconductor die (201) mounted on a substrate (501) such that electrically conductive material (202) formed on each of the bond pads of the semiconductor die (201) extends through a corresponding well (503) formed in a dielectric layer (502) on the substrate to contact electrically conductive material formed in the surface of the substrate on which the dielectric layer is situated. In another embodiment of the invention, the electrically conductive material is a coined ball bond, which can have a conical section on top of a base section.</p> |
