MANUFACTURE OF THIN FILM MULTILAYER INTERCONNECTION BOARD

摘要

PURPOSE:To provide a thin film multilayer interconnection board manufacturing method in which at least two or more protective films are formed by utilizing organic insulating films in thin films for protecting a metallic pattern formed on a ceramic substrate in electronic material components in which thin film multilayer interconnection is formed on the ceramic substrate and the organic insulating films are collectively removed in a metallic pattern exposing process. CONSTITUTION:Thin film multilayer interconnection is formed on pads 3 for leading out a wiring pattern formed on a ceramic substrate 1 together with airtightly sealing metallized parts 4. At the time of forming the wiring, at least two or more organic insulating films 6 are formed in thin films on the parts 4. In the exposing process of the parts 4, a negative resist film is formed on the entire surface of a thin film forming section and protective films composed of the two or more organic insulating films 6 are collectively removed by etching.