Method of manufacturing chip-type piezoelectric-resonator

摘要

In order to improve reliability in electrical connection between internal terminal electrodes and external electrodes in a chip-type piezoelectric-resonator which, protected with resin so as to be capable of surface mounting, a mother substrate is prepared comprising a piezoelectric substrate and a plurality of piezoelectric resonance elements formed thereon. Thick-film electrodes are formed so as to cover the terminal electrodes of the respective piezoelectric resonance elements. Thermosetting protective resin members are applied to cover both major surfaces of the mother substrate, which in turn is divided into individual piezoelectric resonance elements so that the thick-film electrodes are exposed on divided surfaces formed by dividing step. External electrodes are formed on the divided surfaces.