发明名称 RESISTANCE DIFFUSION JOINING METHOD
摘要 PURPOSE:To prevent occurrence of peeling at a joining surface after heat treatment by interposing a copper alloy intermediate layer softer than a copper alloy member between a copper alloy member and steel member. CONSTITUTION:A 75 Cu-25 Zn plating layer 2 of 20mum thickness is formed on the surface of a steel member 1, placing a brazing filler metal 3 thereon and a copper alloy intermediate layer 4 of 0.5mm, this is sandwiched by Ag-W electrode to be pressed and energized. After joining the intermediate layer 4, a brazing filler metal 5 is placed on the intermediate layer 4, further a copper alloy sliding member 6 is placed thereon to be pressed and energized, obtaining the required joining member. As a result, as the copper alloy intermediate layer 4 of 0.2 proof stress of <30kgf/mm is sandwiched between a steel member 1 and copper alloy sliding member 6 of 0.2 proof stress >=30kgf/mm, after joining and heat treatment, peeling of the joined part does not cause. By this method, the occurrence of peeling at the joined surface after heat treatment is prevented.
申请公布号 JPH06292963(A) 申请公布日期 1994.10.21
申请号 JP19930082186 申请日期 1993.04.08
申请人 KOMATSU LTD 发明人 INOUE SHINICHIRO
分类号 B23K1/00;B23K1/19;B23K3/04;B23K20/00;(IPC1-7):B23K1/00 主分类号 B23K1/00
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