| 摘要 |
<p>PURPOSE:To obtain a small-sized lead frame of high level of integration and a completed lead frame, by unifying a first frame part and a second frame part in an interated body bonded at a plurality of portions. CONSTITUTION:In a semiconductor device, a semiconductor element (chip of pellet) 11 is mounted and fixed on a die pad part (head part), and inner leads 13 stretch to the inside on the upper surface of the semiconductor element 11. The tip parts of the inner leads are connected with facing electrodes 14 formed on the periphery of the semiconductor element 11 by using bonding wires 15. The whole part is sealed with resin, and sealing resin interposes also between the lower surfaces of the inner leads 13 and the surface of the semiconductor element 11. Hence the inner leads can be arranged on the semiconductor element after the die pad and the leads are separately formed by using a dual lead frame, so that a large semiconductor element can be accommodated in a small package, and the high level of integration of a semiconductor device is realized.</p> |
