发明名称 Injection mould
摘要 The injection mould serves for the injection moulding of base plates for use as an information storage medium, for instance as a photoelectromagnetic plate or the like. Each moulding cycle comprises the following steps: filling a cylindrical mould cavity with molten resin, forming a central opening in the base-plate moulding and recompressing the base-plate moulding with the mould cavity closed. During recompressing, the base-plate moulding is pressed with high internal pressure against the walls of the mould cavity and against the outer wall of a cutting sleeve, with the result that the finished base-plate moulding has a high density and exhibits a smooth surface at the central opening. <IMAGE>
申请公布号 DE4410015(A1) 申请公布日期 1994.10.20
申请号 DE19944410015 申请日期 1994.03.23
申请人 SEIKOH GIKEN CO., LTD., MATSUDO, CHIBA, JP 发明人 TAKAHASHI, MITSUO, MATSUDO, CHIBA, JP
分类号 B29C45/26;B29C45/38;B29C45/56;B29L17/00;G11B7/26;(IPC1-7):B29C45/26;B29C45/40 主分类号 B29C45/26
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