| 摘要 |
PURPOSE:To increase an electronic component mounting area by connecting a lead terminal to the edge of one of two circuit boards, providing a soldering connection part at the part of the other board not smaller than the one board corresponding to a connection part, and solder-connecting the corresponding connection parts. CONSTITUTION:The U-shaped engaging part 15a of one end of a lead terminal 15 is engaged with an electrode 12a formed at the edge of a circuit board 11, and soldered by dip soldering. Solder paste is printed on the electrode of the part corresponding to the engaging part 15a of the terminal 15 of the edge of the back face of a circuit board 16 to form a connecting solder printed part 18. The engaging part 15a connected fixedly to the board 11 is superposed to be mounted on the solder printed part 18 of the board 16, and reflow soldered. Since the board 11 connected with the terminal 15 is formed in the same size as that of the board 16, the mounting area of the board 16 can be increased. |
