| 摘要 |
<p>PURPOSE:To provide a chip resistor and manufacture thereof by a method wherein a high resistance value is obtained even when the resistor is miniaturized without deterioration in characteristics and also without increase in production cost. CONSTITUTION:First, an insulating protective film 3 is formed by coating in a strip form of 0.7mm wide conductive paste, containing the glass mainly composed of RuO2, on the center part of the side face in longitudinal direction of a cylindrical ceramic base material 1 containing 96% aluminum by drying and firing it at 850 deg.C. Then, the surface of a resistor 2 is rectangularly coated with glass paste in the prescribed width, and an insulating protective film 3 is formed. Subsequently, the end part of the base material 1 is dipped in the electrode paste mainly composed of Ag to the position where the insulating protective film 3 is formed, calcined at 600 deg.C in the air, and an electrode 4, mainly composed of AG, is formed on the part other than the insulating protective film 3. Then, the resistor 2, together with the insulating protective film 3, is trimmed and after its resistance value has been adjusted, sheathing resin is coated on the prescribed position, hardened by calcination at 150 deg.C for thirty minutes, and an Ni and Pb/Sn electroplating treatment is provided on the electrode 4.</p> |
