| 摘要 |
PURPOSE:To provide a method of forming an insulating layer, in which voids and stepped surface of the insulating layer are not produced and which does not increase a usage material even in a multilayer printed wiring board in which the thickness of a conductor part such as a conductor circuit or the like in an inner layer has become thick. CONSTITUTION:In a process for manufacturing a multilayer printed wiring board, conductor parts 12 such as conductor circuits 12a or the like are formed on base materials 11 composed of a plurality of layers and the individual base materials 11 are integrated while the conductor parts 12 are being insulated by an insulating layer 13. In the process, the individual base materials 11 which have the conductor parts 12 are dipped in a resin tank which is arranged in a vacuum container and in which an insulating resin ink having a prescribed viscosity has been put, and a raw insulating layer 13a is formed on the surface of the base materials 11. After that, a pressure roller 14 is made to act on the raw insulating layer 13a, and the insulating resin ink which is excess is removed and then hardened. Thereby, the raw insulating layer 13a is changed into the insulating layer 13. |
