| 发明名称 |
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| 摘要 |
A package for enclosing, protecting and cooling semiconductor integrated circuit chips. The package includes a generally planar substrate with the chips positioned thereon. Signal connections are provided between at least some of the chips. A heat sink is positioned in contact with the chips and includes microchannels through which a cooling fluid flows for purposes of transferring heat generated by the chips to such fluid. Manifolds are provided to direct the fluid to and from the microchannels, and microcapillary slots may be formed on the heat sink surface adjacent the chips to receive liquid to generate attractive forces between the heat sink and chips to facilitate heat transfer. Circuitry is provided to distribute power through the package and to the chips. |
| 申请公布号 |
JPH0680756(B2) |
申请公布日期 |
1994.10.12 |
| 申请号 |
JP19870079545 |
申请日期 |
1987.03.31 |
| 申请人 |
MAIKUROEREKUTORONIKUSU ANDO KONPYUUTAA TEKUNOROJII CORP |
发明人 |
DENISU JEEMUSU HAARERU;DEBITSUDO AASAA GIBUSON |
| 分类号 |
H01L23/40;H01L23/473;H05K7/20;(IPC1-7):H01L23/473 |
主分类号 |
H01L23/40 |
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