| 摘要 |
<p>PURPOSE:To realize miniaturization and high density mounting by arranging a chip and the like containing a microcomputer on a pair of substrates forming a sealing space, and arranging a nonvolatile storage chip on a header formed on one of the substrates. CONSTITUTION:A sealing space 21 is formed by facing substrates 2, 3 case material 9, a lid body 22, etc. A conducting path 5, and a chip of a circuit element 8 including a microcomputer are arranged on the substrates 2, 3 of the sealing space 21. On one of the substrate, e.g. the substrate 2, a header mounting body 4a is formed, and thereon an EPROM 6 of nonvolatile storage is arranged, which is connected with the desired conducting path 5 by wire bonding. Said ROM 6 is covered with ultraviolet-ray transparent resin 21a, and capable of free rewiring. By the effective arranging of chip element and the like utilizing the sealing space and the arrangement of EPROM using the header, the constitution is miniaturized and mounting density is increased.</p> |
