发明名称 Connection arrangement with PC board
摘要 A connection arrangement with PC board features a ceramic substrate glued to a base plate of metal, used as a cooling body. Islands have been hollowed out of the adhesive layer and are filled with thermally conductive paste. Particularly effective thermal dissipation is possible in the area of the islands filled with thermally conductive paste, so that the islands are always disposed underneath components with great energy or heat dissipation.
申请公布号 US5355280(A) 申请公布日期 1994.10.11
申请号 US19930133529 申请日期 1993.10.07
申请人 ROBERT BOSCH GMBH 发明人 ROETHLINGSHOEFER, WALTER;GOEBEL, ULRICH;GERSTNER, ROLAND
分类号 H05K1/02;H05K1/03;H05K1/05;H05K3/00;H05K3/38;H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K1/02
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