| 发明名称 |
Multilayer circuit board having microporous layers and method for making same |
| 摘要 |
A microporous, photoprocessable, moderately hydrophilic material on which metal can be deposited directly using electroless plating techniques, and its use in preparing printed wiring boards and circuit components.
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| 申请公布号 |
US5354593(A) |
申请公布日期 |
1994.10.11 |
| 申请号 |
US19920973939 |
申请日期 |
1992.11.10 |
| 申请人 |
THE FOXBORO COMPANY |
发明人 |
GRANDMONT, PAUL E.;LAKE, HAROLD;ANDERSON, RICHARD A. |
| 分类号 |
H01L21/48;H05K3/00;H05K3/10;H05K3/18;H05K3/24;H05K3/38;H05K3/42;H05K3/46;(IPC1-7):B32B9/00 |
主分类号 |
H01L21/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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