| 摘要 |
The present invention relates to a process for manufacturing a card comprising at least one electronic element (14), especially a card having no exterior contact and also comprising a coil (16). According to the process of the invention, the provision, on a work surface (2), of a structure (10) serving for the positioning of the electronic element (14) and of the coil (16) is envisaged. This structure (10) is formed by a meltable material. By providing energy, the structure (10) is at least partially melted and a pressure is applied to this structure while melting to form a mass in which the electronic element (14) and the coil (16) are embedded. <IMAGE> |
