Method & apparatus for dissipating thermal energy

摘要

Heat sink apparatus for cooling large electronic devices is formed with a heat sink body having a plurality of pins extending outwardly from the base of the heat sink body and a rotary fan having a blowing surface mounted adjacent the outer extremity of the pins. The pins are separated by intersecting grooves providing a large surface area for the heat sink body. The surface area of the heat sink body is sufficiently large to provide a thermal impedance of substantially less than 1.0 DEG C./W and the volume occupied by the heat sink is sufficiently small to provide a volume performance value of less than about 6 DEG C. in3/W.