发明名称
摘要 PURPOSE:To obtain a carrier film, excellent in adhesiveness and mold releasability and suitable for use in transfer molded wiring boards by making a specific wax present in a polyester film, reducing heat shrinkage of the above- mentioned film and specifying the film thickness. CONSTITUTION:A biaxially oriented polyester film (e.g., polyethylene terephthalate), obtained by containing 0.1-3wt.%, preferably 0.3-2wt.% wax (e.g., montanic acid ester wax) consisting essentially of a 50-100C ester compound containing a >=20C higher fatty acid as an acid component and a >=20C higher alcohol or >=2C polyol as an alcohol component and having <=0.5%, preferably <=0.1% heat shrinkage factor (150 deg.C) and 25-150mu, preferably 50-100mu thickness.
申请公布号 JPH0678441(B2) 申请公布日期 1994.10.05
申请号 JP19880276043 申请日期 1988.11.02
申请人 TEIJIN LTD 发明人 ASAI TAKEO;SANENOBU KAZUYUKI
分类号 C08J5/18;C08K5/10;C08L67/00;C08L67/02;H05K3/00;H05K3/20;(IPC1-7):C08J5/18 主分类号 C08J5/18
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