发明名称 |
Edge-mounted, surface-mount integrated circuit device |
摘要 |
An edge-mounted integrated circuit device (10 ) includes a semiconductor die (11) and a lead frame (15) attached to the semiconductor die (11). The lead frame (15) includes a plurality of leads (14) electrically connected to the semiconductor die and lead frame supports (16, 18). A package (12) encapsulates the semiconductor die and a portion of the lead frame (15). The leads (14) extend from the package (12) and are bent to present a face for surface mount connection to conductors on a substrate. The supports (16, 18) extend from the package (12) for contacting the substrate to support the device (10) in position for soldering the leads (14) to conductors on the substrate. |
申请公布号 |
US5352851(A) |
申请公布日期 |
1994.10.04 |
申请号 |
US19920941996 |
申请日期 |
1992.09.08 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
WALLACE, JAMES S.;RUSSELL, ERNIE;BAUDOUIN, DANIEL |
分类号 |
H01L23/495;H05K3/30;H05K3/34;(IPC1-7):H01L23/02 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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