| 摘要 |
An IC socket for testing various IC packages is has guide sections to restrict the cover from tilting during operation without providing guide posts at four corners of the socket. The IC socket has a body with a plurality of contacts for electrical contact with leads of an IC package and a cover releasably loading the IC package on the socket body by vertical movement, a plurality of guide sections extending vertically being formed on the respective insides of four side surfaces of the cover, and a plurality of engaging sections for engaging with the guide sections, supporting vertical movement of the cover and preventing the cover from tilting during testing of the IC package, being formed respectively, on four side surfaces of the socket body.
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