| 摘要 |
PURPOSE:To provide a simple multilayer wiring board manufacturing method with which poor adhesion of an inner layer circuit board and an adhesive insulating layer can be prevented and the treatment solution used in the course of manufacture hardly remains on the interface of the above-mentioned circuit board and the insulating layer. CONSTITUTION:When the copper foil wiring layer 1 of an inner layer circuit board is surface- treated and a multilayer wiring board is manufactured by laminating a plurality of inner layer circuit boards through the intermediary of an adhesive insulating layer, a blacking treatment, using an adhesive oxidation treatment solution, as a surface treatment and an oxidation treatment, using phosphoric acid treatment solution containing pH of 0 to 3%, are conducted. By the above-mentioned treatments, very fine recesses and protrusions are formed on the surface of the wiring layer 1, and the adhesive strength between the wiring layer 1 and the adhesive insulating layer can be improved. Accordingly, as the infiltration of the treatment solution between the wiring layer and the adhesive insulating layer is suppressed even when the treatment is conducted by an oxidation solution in the course of manufacture of the multilayer wiring board, the occurrence of a haloing phenomenon can be suppressed, and the treatment solution used in the manufacture does not remain on the interface. Also, as the pH stability of phosphoric acid is excellent, a number of circuit boards can be oxidation-treated continuously. |
