发明名称 MANUFACTURE OF CERAMIC MULTILAYER WIRING SUBSTRATE
摘要 PURPOSE:To cut down the working hours for through hole formation, and to prevent generation of the error in data input by a method wherein through holes are punched out on the position common to all green sheets, and after conductive paste has been selectively filled in the through holes, insulating paste is filled in the remaining through holes. CONSTITUTION:A through hole 4, which is a both surface penetrating hole to be formed on the through hole providing position for conduction of both surfaces of one of a plurality of kinds of green sheets 1, is punched out. Then, after conductive paste 8 has been filled in the through hole only on the position where conductive through hole is provided using the screen 7 corresponding to each type of green sheet, insulating paste 9 is filled in the remaining through holes. For example, after the conductive paste 8 has been printed from the side of a carrier film 2 using a screen 7 and a squeegee 6, the screen 7 is removed, and the insulating paste 9 is printed using the squeegee 6.
申请公布号 JPH06275955(A) 申请公布日期 1994.09.30
申请号 JP19930064538 申请日期 1993.03.24
申请人 NEC CORP 发明人 SUYAMA TAKAYUKI
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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