发明名称 |
Three-dimensional circuit modules |
摘要 |
Disclosed is a three-dimensional circuit structure particularly useful in semiconductor memories. The circuit structure consists of a stack of modules mounted on a mother board with connectors between adjacent modules in the stack. The connectors mate with staggered and through terminals on the modules; the staggered terminals being used for circuits routed to destinations on specific modules and the through terminals for circuits routed to destinations on more than one module. |
申请公布号 |
HK102794(A) |
申请公布日期 |
1994.09.30 |
申请号 |
HK19940001027 |
申请日期 |
1994.09.22 |
申请人 |
AMERICAN TELEPHONE AND TELEGRAPH COMPANY |
发明人 |
WAYNE H MILLER |
分类号 |
H01L25/00;H01L23/538;H01L25/065;H01L27/00;H01R12/70;H05K1/14;H05K7/02 |
主分类号 |
H01L25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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