| 摘要 |
PURPOSE:To provide an acceleration sensor where the inside of the sensor is hermetically sealed completely, the production process is simple and the sensor can be mounted easily on a circuit board or the like. CONSTITUTION:A connection hole 9 is made in a glass cover 6, a connection cover 7 is installed so as to seal the connection hole 9, gaps 13 are formed on both the right and left sides of the connection cover 7 so as not to be connected electrically to the connection cover 7, nonconductive covers 8 are pasted respectively on the glass cover 6 by an anodic bonding method. Then, a fixed electrode 5 is formed integrally on the glass cover 6 and a thinfilm conductive part 10 is formed integrally on the connection hole 9 by a sputtering method, and the fixed electrode 5 is connected electrically to the connection cover 7. This assembly and another assembly of the same constitution are pasted, by the anodic bonding method, on the surface and the rear surface of a silicon frame 1 on which a mask 3 and the like have been formed, a cutout part 12 is formed in the glass cover 6 and the nonconductive cover 8, and a movable- electrode extraction part 11 is formed on the frame 1. |
