发明名称 SURFACE MOUNT-ABLE INTEGRATED PACKAGE HAVING INTEGRATED BATTERY MOUNT
摘要 PURPOSE: To endure against temperature of a solder reflow process by disposing a battery between a lower side battery and an upper side battery to exist a gap between a part of the batteries and a package body, and integrating the batteries therein. CONSTITUTION: Cells 20 are isolated from a surface of a header 12-at a distance d1 in combination of a lower side battery 22 and a lower side stand-off 26. Similarly, the cells 20 are isolated from the housing 30 at a distance dn in combination of an upper side battery 24 and an upper side stand-off 26. Thus, air gaps are formed between the header 12 and the cells 20 and between a housing 30 and the cells 20, giving high insulation around the cells 20. Accordingly, the cells 20 can be retained at relatively low temperature during solder reflow processing period.
申请公布号 JPH06275773(A) 申请公布日期 1994.09.30
申请号 JP19930317688 申请日期 1993.12.17
申请人 S G S THOMSON MICROELECTRON INC 发明人 DEI KUREIGU DEIKUSON;MAIKERU JIEI HANTO
分类号 H01L25/00;H01L23/495;H01L23/58;H01M2/10;H01M2/20 主分类号 H01L25/00
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