WAFER WASHING DEVICE

摘要

PURPOSE:To suppress re-adhesion of eliminated particles by allowing a circular brush to contact one surface of a wafer and then its rotary center axis to cross the wafer main surface and to have a diameter which is equal to or more than the radius of the wafer and is equal to or less than the diameter and to rotate relatively and then the circumference of the brush to be inscribed to the circumference of the wafer and to rock. CONSTITUTION:A circular brush 120 for washing a wafer W for semiconductor can contact one surface of a wafer W which is retained to a holding nib and is laid out so that the rotary shaft crosses the wafer W and then the diameter is equal to or more than the radius of the wafer W and is equal to or less than the diameter. A motor 124 rotates the circular brush 120 for the wafer W and then rocking shafts 102 and 103 and a motor 111 rock the wafer W so that the circumference of the circular brush 120 is inscribed to the circumference of the wafer W for the circular brush 120, thus preventing eliminated particles from being adhered again.