COPPER CLAD LAMINATED SHEET AND PRINTED WIRING BOARD

摘要

PURPOSE:To provide a copper clad laminated sheet for a printed wiring board obtaining an etching factor of a high value without lowering peel strength and preventing the adhesion and remaining of copper particles at the root parts of wiring patterns and having wiring patterns of a fine pitch. CONSTITUTION:A copper clad laminated sheet is obtained by bonding electrolytic copper foil 1 having a copper deposit 2 formed on the gloss surface 1a thereof to the single surface or both surfaces of a substrate 1 on the side of the gloss surface 1a thereof and a printed wiring board is obtained using the copper clad laminated sheet.