| 摘要 |
The present invention is an integrated computer module that has a chip carrier assembly attached to a cryogenic cooler. The carrier assembly includes a multichip that has a CPU comprising a plurality of high speed chips. The carrier also has a plurality of external pins that allow the chips to be coupled to an external device. Attached to the carrier is a vacuum-sealed enclosure constructed to eliminate moisture condensation on the pins, and minimize the heat flow from the ambient to the coldplate of the cooler. The vacuum-sealed enclosure is connected to the coldplate with springs to ensure good thermal contact between the cooler and the carrier assembly. The refrigerator runs on a Stirling cycle and contains pressurized helium as the cooling fluid. The coldplate temperature can be maintained at a constant temperature as low as -60 DEG C. while removing 40 watts of active heat load generated by the CPU.
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