发明名称 METHOD OF WIRE BONDING
摘要 PURPOSE:To provide a method of wire bonding, which comprises the steps of holding wire under slight tension with a clamp, raising the cut clamp and a capillary tool by a tail length, and applying shear tension to cut the wire off, wherein stable wire tails are obteined. CONSTITUTION:When a capillary tool 1 touches a substrate 6, a control section 50 receives a ground signal and instructs a load switch 51 to grasp wire 2 with slight tension. The wire is loose in the capillary tool in this condition. The control section instructs a motor 15 to raise a horn 12. At the same time, a moving pad 32 rises and pulls the wire up, and the wire becomes tight. The wire is further pulled up until a predetermined tail length is obtained, and the control section instructs the load switch to apply shearing load to a cut clamp 30. While the motor continues to run to raise the capillary tool, the wire breaks and leaves the substrate when the wire tail becomes longer than the predetermined length.
申请公布号 JPH06268006(A) 申请公布日期 1994.09.22
申请号 JP19930050461 申请日期 1993.03.11
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HAJI HIROSHI
分类号 H01L21/60 主分类号 H01L21/60
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