| 摘要 |
PURPOSE:To enhance the crack-resistant property of a package in a solder reflow operation. CONSTITUTION:A hole is formed in the central part of a die pad 22. A semiconductor element 21 is mounted on the die pail 22. The surface and the back of the semiconductor element 21 are coated with a highly adherent material (e.g. a polyimide) 24. One part of the back of the semiconductor element 21 is exposed. However, since the highly adherent material 24 is formed in its exposed part, the semiconductor element 21 is brought well into contact with a sealing resin 23. In addition, a die bonding material 25 is formed only between the back of the semiconductor element 21 and the die pad 22.
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