| 摘要 |
<p>PURPOSE:To obtain a temporarily adhesive sheet, which is bonded well to an adhered, is released easily, has a releasability and does not generate also an adhesive transfer on the adherend, by a method wherein a compound prepared by stirring and foaming a specified mixed emulsion and a crosslinking agent is heated and dried. CONSTITUTION:A crosslinked urethane emulsion or the mixed emulsion of a crosslinked urethane emulsion and a crosslinked acrylic emulsion is stirred and formed along with a crosslinking agent to cause a crosslinking reaction and the formed matter is applied on a mold-releasing process paper surface in an even thickness and is dried at 100 to 160 deg.C. Thereby, the mixed emulsion containing bubbles loses a dispersing medium and is turned into a sheetlike foam having uniform and fine bubbles. Accordingly, an obtained temporarily adhesive sheet 1 makes semiconductor wafers 2 fix reliably on a surface plate 5 and the wafers 2 can be polished. Moreover, after the wafers 2 are polished, an adhesive transfer is never generated on the surface plate 5 and moreover, the sheet 1 can be easily released without cracking most of the wafers 2.</p> |
