发明名称 MULTILAYER PRINTED WIRING BOARD
摘要 <p>PURPOSE:To provide a multilayer wiring board capable of preventing insulating substance for the adhesion of resin, etc., from flowing much into holes, capable of preventing part insertion from becoming difficult, and capable of preventing a circuit pattern from malfunctioning. CONSTITUTION:A first base material 12 had holes 15 penetrating first and second layer surface at specified parts. And a second base material 13 has circular protrusions 17 having outside diameter larger than the holes 15.</p>
申请公布号 JPH06268372(A) 申请公布日期 1994.09.22
申请号 JP19930053404 申请日期 1993.03.15
申请人 TOSHIBA CORP 发明人 YAMAMOTO YUICHI
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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