| 摘要 |
PURPOSE:To eliminate purple plague in Al fine wire joint and improve water resistance and airtightness in IC package sealing, by pressure-fitting Al-Si alloy thin plate and Au-Ge alloy thin plate on both sides of Ni or Ni-containing alloy base material. CONSTITUTION:Clad base material 31 consists of Ni or iron alloy containing Ni, such as Kovar. Layer 32, which is fitted on its one side, is made of Al or Al-Si alloy. Layer 33, which is fitted on its other side, is made of Au-Ge alloy. For Al-Si alloy, Si comprises 0-5wt%. For Au-Ge alloy, Ge comprises 6-12wt%. |
