发明名称 |
Verfahren zur Herstellung einer formverkapselten Drucksensor-Halbleitervorrichtung |
摘要 |
A pressure sensor element (50) is bonded to a die bonding pad (4). The pressure sensor element (50) is thereafter entirely covered with epoxy resin (11) and completely packaged. Following this, the epoxy resin (11) is locally removed at a portion above a diaphragm (5) of the pressure sensor element (50). As a result, the diaphragm (5) is exposed. In this method, the diaphragm (5) is uncovered without using a special metallic mold which prohibits the epoxy resin (11) from flowing into a space above the diaphragm (5). A gold wire (8) is also molded by the package sealing. Thus, a resulting package-molded pressure sensing semiconductor device is highly reliable under adverse environmental conditions and considerably cost-effective. |
申请公布号 |
DE4219575(C2) |
申请公布日期 |
1994.09.22 |
申请号 |
DE19924219575 |
申请日期 |
1992.06.15 |
申请人 |
MITSUBISHI DENKI K.K., TOKIO/TOKYO, JP |
发明人 |
ISHIBASHI, KIYOSHI, ITAMI, HYOGO, JP |
分类号 |
G01L19/14;G01L9/00;H01L21/56;H01L23/28;H01L29/84;(IPC1-7):G01L19/04;H01L21/60;G01L7/08 |
主分类号 |
G01L19/14 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|