发明名称 |
CUTTING METHOD BY LASER BEAM |
摘要 |
PURPOSE:To provide the cutting method by laser beams capable of increasing the cutting thickness by laser beam cutting. CONSTITUTION:A first laser beam 1 in the front in the cutting proceeding direction and a second laser beam 2 in the rear in the cutting proceeding direction cross each other at a point P in the cutting surface. The upper part A of material is melted and cut by the first laser beam 1 and the lower part B of the material is melted and cut by the second laser beam 2. Consequently, a metal plate having the thickness of about two times as much as the cutting thickness can be cut. |
申请公布号 |
JPH06262378(A) |
申请公布日期 |
1994.09.20 |
申请号 |
JP19930055249 |
申请日期 |
1993.03.16 |
申请人 |
KAWASAKI HEAVY IND LTD |
发明人 |
ATSUTA TOSHIO;SAKURAI TAKASHI |
分类号 |
B23K26/00;B23K26/04;B23K26/38 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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