PLASTICIZED POLYETHERIMIDE ADHESIVE COMPOSITION AND ITS USE

摘要

A plasticised polyetherimide adhesive compsn. having a melt viscosity providing void-free adhesive bonding at 200-260 deg. C between an overlay dielectric layer and a substrate carrying at least one IC chip, comprises: (A) 100 pts. wt. polyetherimide; and (B) 5-25 pts. wt. plasticiser. Also claimed is a high density interconnect circuit array including an adhesive layer as above. A high density interconnect circuit array including a laminate layer overlaying the IC chip(s) and having via openings aligned with interconnection pads, the laminate layer carrying a pattern of interconnecting conductors and comprising a dielectric layer and an adhesive layer as above in direct contact with the IC chip(s).