| 摘要 |
In a fluorescent display panel containing an IC chip therein, lead conductor bonding pads exposed from an aperture of an insulator layer are arranged nearby the IC chip mounting area. At least one of the lead conductor bonding pads is provided with marker for indicating the center position of the lead conductor bonding pad. An operator of wire bonding of the display panel observes the marker by a monitor TV, and enters a compensation to a bonding program when necessary. |
