MANUFACTURE OF MULTILAYERED PRINTED WIRING BOARD

摘要

PURPOSE:To provide a method for manufacturing a wiring board used by cleaning with an alkali permanganate solution before an inner layer board is treated for interlayer adhesion. CONSTITUTION:A method for manufacturing a title wiring board which uses an inner layer printed wiring board comprising the surface of a copper foil cleaned with an alkalipermanganate solution before the copper foil is surface- treated for interlayer adhesion after an inner layer printed wiring network is formed.