| 摘要 |
<p>PURPOSE:To enable the title soldering step to be stably performed by preventing a fused solder from naturally jutting out of part junctioned positions in the soldering step. CONSTITUTION:Within the title semiconductor device wherein a semiconductor chip 1 and an outer leading terminals 9 are solder-mounted on a metallic base 6 through the intermediary of an insulating substrate 3 and a base 2 for chip, solder resists 8 are previously coated on the ambient regions of the sealing positions set up on the metallic base 6 and the base for chip 2 corresponding to the semiconductor chip 1 and the outer leading-out terminals 4 before starting the soldering step of respective parts.</p> |
